Board Simulation and Analysis

In the realm of modern electronics, the demand for compact yet high-performance devices has surged, necessitating the development of higher density PCBs. With the proliferation of high-performance microprocessors and high-speed interfaces, the challenge lies in ensuring superior signal integrity and reliable data transmission. While microprocessor and chip technologies have made significant strides, PCB fabrication methods have struggled to keep pace, impacting overall system performance.

Signal Integrity Analysis emerges as a critical factor in this landscape, affecting the electrical performance of systems. It is imperative for design engineers to implement robust SI analysis methodologies throughout the product development cycle. Neglecting signal integrity can lead to a myriad of issues including crosstalk, reflection, electromagnetic interference (EMI), and signal distortion.Our expertise spans mixed signal, RF, analog, and digital designs, catering to a wide range of applications from lifestyle to defense. We specialize in tackling signal integrity challenges inherent in densely packed, low-power, small form-factor circuits.

Our comprehensive Signal Integrity Analysis Services cover both board level and system level analysis, encompassing pre- and post-layout stages. We meticulously address every design aspect including clock distribution, signal path design, noise margin, impedance matching, transmission line effects, and power distribution to mitigate signal integrity issues effectively.

With a keen focus on detail and a commitment to excellence, we ensure that our designs meet the highest standards of reliability and performance, enabling our clients to stay ahead in the ever-evolving landscape of technology.

Pre Layout

  • Dielectric material selection

  • Topology optimization

  • Stack up Design

  • Termination schemes

  • Placement and Routing specifications and guidelines

  • Transient Analysis

  • Eye Diagram Analysis

  • Frequency Domain Analysis

Our Capabilities

Post Layout

  • Simulation of board

  • Reflection and Crosstalk Analysis

  • EMI and PDN Analysis

  • Cross talk Analysis

  • Transmission line behavior Analysis

  • Transient Analysis

  • Rise/fall time Analysis

  • Channel Analysis for Serial Communication

Thermal Analysis

  • Review and identify PCB thermal Issues

  • Verify Thermal interference

  • Create board thermal profile

  • Optimize thermal via design and placement

  • Heat sink performance evaluation

  • Optimize board cooling methods

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